Waferhandling.Product

WAM300 VAC-WaferAlignmentModule

WAM300 WaferAlignmentModule for vacuum environment

For automatic wafer alignment within the vacuum environment.

Adenso.Advantages:

INTEGRABLE easy integration into cluster systems

FLEXIBILITY different substrate sizes and gemometries

PRODUCTIVITY fast alignment

PRESISION precise Adenso DDU direct drive unit

COMPLEXITY save invest and operating costs with Adenso.Solutions

The blue Adenso.Solution

SMART with a small footprint and a lot of advantages for Adenso.Clients

For alignment of 300mm wafer inside cluster systems directly and without (!) atmospheric
handling robots. The WAM300 is excellent for combination with Adenso WHR WaferHandlingRobot – via interface the robot gets automatically the correction data from the WaferAlignment Module.

FOOTPRINT Saves cleanroom floor space because of direct integration into vacuum environment.

COSTS Saves investment and operating costs for unnecessary tools.

Specification

SUBSTRATES
– Wafer 300mm
– Wafer 200mm
– all kind of substrate geometry can be detected

PAYLOAD
Standard: up to 1kg

CLEAN ROOM
Clean room suitability up to ISO class 3 / US FED class 1

INTERFACES
Ethernet

Adenso.Kontakt

+49 351 79 59 79 70

E-Mail: info(at)adenso.de

Adenso Industrial Services GmbH
Adenso GmbH
Zur Wetterwarte 27
01109 Dresden
Germany

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