Pre- and Post-Processing.Module

In many cases, Adenso Wafer.Platform customers’ processes require high process temperatures. If the substrates are loaded into the process at no temperature, a heating-up time is required – and this in the main process time, i.e. valuable process time is required for this; The same applies to the cooling phase after such high temperature processes.

The Adenso Robot.Platform portfolio now includes temperature control modules suitable for every substrate size:

COOLING.Module: cooling of substrates after thermal processes
HEATING.Module: heating of substrates as process preparation

• Adenso.Solution: Significant saving of valuable process time!
• The HEAT/COOL.modules can easily be docked onto the central Robot.platform
• When the VAC.ROBOTICS Platform is delivered, the additional modules are already set up, tested and ready to use!
• Taken into account in the master interface adControl.