Automatic wafer loading

The ALM230X optimizes your substrate handling by automatic loading/unloading substrates from standard and/or customized wafer magazines to your process.

Closes the gap
between manual loading solutions and wafer handling robot systems

Process reliability
High precision and space saving kinematics, substrate mapping, ID reader for magazine identification

Flexibility
Customized integration of different kind of test equipment, vision systems, alignment under combination of different cassette types

Suitable
for substrates up to 200mm, round and square types, also available for 300mm

ToolCloud
The Adenso.ToolCloud manages and monitors all Adenso.Solutions from the start of the project to ongoing production

pdf.downloads

Adenso ALM230X AutoLoad Module.pdf