Wafer&Cluster.Product
ALM230X | AutoLoad Module | high vacuum type
ALM230X | AutoLoad Module | high vacuum type
Automatic wafer loading
The ALM230X optimizes your substrate handling by automatic loading/unloading substrates from standard and/or customized wafer magazines to your process.
Closes the gap
between manual loading solutions and wafer handling robot systems
Process reliability
High precision and space saving kinematics, substrate mapping, ID reader for magazine identification
Flexibility
Customized integration of different kind of test equipment, vision systems, alignment under combination of different cassette types
Suitable
for substrates up to 200mm, round and square types, also available for 300mm
ToolCloud
The Adenso.ToolCloud manages and monitors all Adenso.Solutions from the start of the project to ongoing production
pdf.downloads
SPECIFICATION
WORKING RANGES
X: customized up to 1m
PAYLOAD
starts from 1 kg up to 25 kg
CLEAN ROOM
clean room suitability up to ISO CLASS 2
SAFETY
SBC safe brake control
VAKUUM RANGE
base press.: 5x 10-7 mbar (option: double sealing)
SOFTWARE
Adenso Robot.Software for easy controlling and teaching
INTERFACES
Ethernet
EtherCAT
Profibus
Adenso AVANTAGES
RANGE
Largest travel ranges = maximum flexibility
PAYLOAD
Highest load capacity = unlimited substrate choice
GATE VALVES
Smart kinematics = smallest gate valves
FOOTPRINT
Space-saving kinematics = small set up area