Adenso wafer handling modules (WHM): model variants out of the Adenso waferhandling systems:
WHM-VAC wafer handling modules
Handling module consisting of a central vacuum chamber with an integrated wafer handling robot WHR-VAC.
Module with up to 4 process stations.
Module with up to 6 process stations.
Module with up to 8 process stations.
DTS 200/300/450 – Device Test System (Datasheet.pdf)
Excellently suited for 200/300/450 mm wafers in combination with all types of test applications in inert gas environments (glovebox),
e.g. SURAGUS non-contact in-line measurement solution for sheet resistance [Ohm/sq] and metal layer thickness [nm, µm]
DTS special/glovebox (Datasheet.pdf)
Applications with special substrates, e.g. rectangular glass plates. Customer-specific CASSETTE LIFTS. Glovebox integration as standard.
Pre- and Post-Processing.Module for every substrate size
COOLING.Module: Cooling of substrates after thermal processes
HEATING.Module: Heating up substrates as process preparation