High energy ion implantation (HEII)
Cluster System Plattform Configuration
advanced High Capacity LoadLock Module
unattained substrate capacity
Wafer handling modules (WHM)
Wafer handling robot
DTS 220X in clean room
in series production
Wafer Handling Equipment
Load modules (LM)
Cluster plattform configuration
Adenso waferhandling systems
Wafer handling modules
Wafer handling systems
Waferhandling equipment for substrate handling in vacuum robotics and glovebox systems
Module concepts as required
Adenso develops unique Waferhandling equipment for vacuum robotics with substrate handling in glovebox systems. Tried and tested basic layouts are adapted to the customer-specific dimensions, process requirements and ranges of motion for each project. In this process, the solutions go from 2 –12 process stations in case of radial layout to box concepts with 6 – 10 process stations in a rectangular basic layout.
Wafer handling robot (WHR)
The Adenso WHR-VAC wafer handling robot is optimised for highest carrying capacity and large ranges. The simple arm geometry allows for small gate valves and compact handler swivel ranges. For handling tasks in the field of vacuum robotics (VacBot), for sensitive and large-scale substrates such as glass and FPD (flat panel display). Also available as a glovebox version and in full stainless steel design.
Wafer handling modules (WHM)
Handling module with integrated WHR-VAC, wafer handling robot optimised for handling substrate carriers in high-vacuum environments.
The number of process stations is design specifically for the respective customer, ranging from a minimum of 4 to more than 8 loading ports. Process chambers and load modules for substrates (LLM) doch onto the handling modules.
Load lock modules (LLM)
Depending on the customer’s request and desired process, there is a wide range of load modules or cassettes in terms of automation and dimension. Scanners, measuring units or heating elements extend the possible applications of vacuum robotics. adLOAD forms a completely new category of LoadLock.Modules for cluster systems, which is characterized by a previously unattained substrate capacity.
High energy ion implantation (HEII) or IMPLANTER (IMP) are components of the modular Adenso wafer handling system.
Adenso supports customers in ion beam physics with the modular Robot.Platform with full handling of the substrates in a high vacuum through the system components:
Wafer handling, IMP process module and beamline.
The handling and process components are adapted to the requirements of the implant technology and the substrates. This means that every implanter system is specially adapted to customer requirements. With adControl, Adenso has created a robust and flexible operating system that controls the modular structure of the VAC.ROBOTICS platform.
Adenso uses the WHM-IMP200X system type for substrates up to 200mm, on which wafer sizes of 150/100/75/50 / 25mm can also be processed. For 300mm wafers, the WHM-IMP300X serves as the starting point for individual configuration.
The use of CARRIERN for the substrates is planned, direct wafer handling by the IMP.Module is also configurable.
The wafer handling modules can be combined with the adLOAD advanced LoadLock modules with twice the wafer capacity to increase the autonomy time. For test and sorting tasks in the clean room, device tester sorters of the modular DTS platform can be added.
With the new ROBOT.Configurator, Adenso offers the solution for planning individual cluster platforms according to your needs.
The required system grows live and three-dimensionally and comes at the end with a detailed summary of all parameters as a PDF.
You can easily, quickly and flexibly run through a wide variety of variants. Try it!
FIVE REASONS for choosing Adenso Wafer Handling Robots (VacBots)
A limited range restricts the possibilities of designing the processing areas. Adenso’s solution: greatest ranges = maximum flexibility!
2. CARRYING CAPACITY
A limited carrying capacity restricts the range and substrate selection and results in process uncertainty. Adenso’s solution: highest carrying capacity = unlimited substrate selection!
3. BYPASS VALVES
Oversized bypass valves result in high investment costs and high operating costs due to large volumes. Adenso’s solution: lean kinematics = very small bypass valves!
4. SETUP AREA
Cleanroom space is expensive. Adenso’s solution: space-saving kinematics = minimum setup area!
Complex kinematics from the atmospheric field are unfavourable in a vacuum. Adenso’s solution: simple setup = saves investment and operating costs!
Adenso’s successful concept in the field of VacBots for waferhandling equipment is to offer our customers a customised solution tailored to their needs, created on the basis of existing or adapted modules from the field of vacuum robotics.
Basic layout + wafer handling robot + wafer handling module + LoadLock module
results in a product with defined interfaces that is immediately ready for use.
Processing wafers of up to 450 mm, heavy-duty capacities of up to 250 kg and extreme ranges are thus possible.
+49 351 79 59 79 70
Adenso Industrial Services GmbH
Am Weiher 3
OT Boxdorf / Dresden