WAM300 WaferAlignmentModule for vacuum environment
For automatic wafer alignment within the vacuum environment.
INTEGRABLE easy integration into cluster systems
FLEXIBILITY different substrate sizes and gemometries
PRODUCTIVITY fast alignment
PRESISION precise Adenso DDU direct drive unit
COMPLEXITY save invest and operating costs with Adenso.Solutions
The blue Adenso.Solution
SMART with a small footprint and a lot of advantages for Adenso.Clients
For alignment of 300mm wafer inside cluster systems directly and without (!) atmospheric
handling robots. The WAM300 is excellent for combination with Adenso WHR WaferHandlingRobot – via interface the robot gets automatically the correction data from the WaferAlignment Module.
FOOTPRINT Saves cleanroom floor space because of direct integration into vacuum environment.
COSTS Saves investment and operating costs for unnecessary tools.
– Wafer 300mm
– Wafer 200mm
– all kind of substrate geometry can be detected
Standard: up to 1kg
Clean room suitability up to ISO class 3 / US FED class 1