Wafer&Cluster.Product

ALM230X | AutoLoad Module | high vacuum type

Automatic wafer loading

The ALM230X optimizes your substrate handling by automatic loading/unloading substrates from standard and/or customized wafer magazines to your process.

Closes the gap
between manual loading solutions and wafer handling robot systems

Process reliability
High precision and space saving kinematics, substrate mapping, ID reader for magazine identification

Flexibility
Customized integration of different kind of test equipment, vision systems, alignment under combination of different cassette types

Suitable
for substrates up to 200mm, round and square types, also available for 300mm

ToolCloud
The Adenso.ToolCloud manages and monitors all Adenso.Solutions from the start of the project to ongoing production

Adenso AVANTAGES

RANGE
Largest travel ranges = maximum flexibility

PAYLOAD
Highest load capacity = unlimited substrate choice

GATE VALVES
Smart kinematics = smallest gate valves

FOOTPRINT
Space-saving kinematics = small set up area

SPECIFICATION

WORKING RANGES
X: customized up to 1m

PAYLOAD
starts from 1 kg up to 25 kg

CLEAN ROOM
clean room suitability up to ISO CLASS 2

SAFETY
SBC safe brake control

VAKUUM RANGE
base press.: 5x 10-7 mbar (option: double sealing)

SOFTWARE
Adenso Robot.Software for easy controlling and teaching

INTERFACES
Ethernet
EtherCAT
Profibus

Adenso.Contact

+49 351 79 59 79 70

E-mail: info(at)adenso.de

Adenso Industrial Services GmbH
Adenso GmbH
Zur Wetterwarte 27
01109 Dresden
Germany

Adenso.Memberships

Adenso.Sponsorships