The term ion–implantation describes the introduction of material into a substrate. In the semiconductor industry, IONs are introduced into wafer base substrates with this technology, the wafers are doped – and thus their electrical properties are changed in a targeted manner so that they can be used for the production of semiconductor components. Since high energy densities are required for this technology, this is also known as High-Energy Ion Implantation (HEII) or ION IMPLANTER (IMP) for short.
A basic structure of an ion implanter system usually consists of the following components:
Ion source > accelerator > beam guidance and shaping (beamline)
>> IMPLANTER.MODULE <<
Waferhandling.Robot.Module < LoadLock.Module < Substrate (wafer)
Ion generation and acceleration as well as the associated beam process technology are components of our customers’ technology – and significantly determine the properties of the finished products.
Adenso supports its customers in the field of ion beam physics on the basis of its modular Robot.Platform with the full handling of the substrates in a high vacuum; Specifically, these are the system components wafer handling, IMP process module and beamline.
The strengths of the Adenso.Team lie in the customer-specific adaptation of the handling and process components to the respective requirements of the implant technology and the substrates used. Each Implanter.System is therefore specially tailored and optimized to the specific requirements of the respective application. By using the tried and tested Adenso VAC.ROBOTICS platform, it is only a matter of adaptations, i.e. in most cases no new developments are required, which significantly limits the risks, guarantees rapid commissioning and, above all, comparable results for repeat systems.
The control of such complex systems requires a robust and yet flexible operating system, especially in the semiconductor industry. With adControl, Adenso has created its own operating system, which maps the modular structure of the VAC.ROBOTICS platform in the control, and thus enables flexible configurations on a stable and reliable basis. Future expansions in the event of process and product adjustments are also already prepared.
The WHM-IMP200X system is designed for substrate dimensions up to 200mm (diameter and rectangle), on which wafer sizes of 150/100/75/50 / 25mm can of course also be processed.
The 300mm wafers are processed on a specially developed WHM-IMP300X platform –- on the one hand due to the differences in dimensions, but mainly due to the completely different automation of the 300mm semiconductor factories (compared to the conventional, smaller wafers).
The use of CARRIERN for the substrates is intended and can be configured depending on the application and customer requirements, but not a condition, i.e. the IMP modules can also be configured for direct wafer handling.
The wafer handling modules can be combined with all common options of the modular VAC.ROBOTICS platform, such as the adLOAD advanced LoadLock modules with double the wafer capacity for an enormous increase in the autonomy time.
These concepts can be rounded off with atmospheric device tester sorters from the modular Adenso DTS platform – for customer-specific test and sorting tasks in clean room environments.