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Adenso Automation Solutions

Advanced automation solutions for the automotive industry

Adenso advanced automation solutions for the automotive industry

Workpiece transfer, small footprint, fast-moving, precise and powerful kinematics, exact positioning, high precision, customised solutions, easy and safe operation, fully automated, high productivity for the automotive industry.

Adenso DTS220X TESTER

Advanced handling solutions for substrates, carriers, magazines

Adenso DTS220X TESTER

  • TESTER: based on Device Tester Sorter platform DTS220X
  • Integration of testing procedures and customer processes
  • Customer-specific substrates, carriers, magazines
  • Substrate alignment
  • Vision systems
  • ID reader

Adenso Wafer Handling Module MAXX

Advanced substrate handling solutions for large substrates up to 3 m x 3 m

Adenso Wafer Handling Module WHM MAXX

  • specially for large-format substrates up to approx. 3 m x 3 m
  • enormous ranges
  • extremely precise kinematics
  • suitable for vertical substrate handling

Adenso Wafer Handling Module ultra

Advanced substrate handling solutions with ultra-wide range

Adenos Wafer Handling Module WHM ultra

  • ultra long range of up to 3x that of other solutions on the market
  • minimal footprint thanks to smart kinematics
  • extremely small gate valves thanks to lean axis geometry
  • extremely high carrying capacity for customer-specific carrier solutions

Adenso Wafer Handling Robot

Advanced substrate handling solutions for vacuum and glovebox environments

Keywords: smallest gate valves, largest travel ranges, highest payload, space-saving kinematics, small footprint in cleanroom, substrate handling by using carriers, wafers up to 450 mm, display substrates, electronic devices, inert gas environment, HF/UHV vacuum systems, vacuum cluster systems, device test systems, transfer modules.

UTG handling ultra-thin glass via R2R

Challenges: very sensitive, ultra-fragile, semi-rigid

Adenso advanced R2R roll-to-roll solutions understand this sensitive topic and can handle these fragile substrates carefully and save your processes.

UTG handling ultra-thin glass via R2R

Challenges: very sensitive, ultra-fragile, semi-rigid

Adenso advanced UTG solutions: ultra-thin glass + R2R processing; ultra-thin glass roll-to-roll handling and processing

Wafer Handling Robots

Adenso presents the WHR VAC wafer handling robot for high-vacuum applications.

WHR VAC Wafer Handling Robot

Characterised by:

  • high carrying capacity and precision
  • extremely long range
  • vacuum capacity up to ISO3
  • and economic efficiency.

Adenso Wafer Handling Robot

Adenso presents WHR VAC wafer handling robot as a trade fair model

Keywords: smallest gate valves, largest travel ranges, highest payload, space-saving kinematics, small footprint in cleanroom, substrate handling by using carriers, wafers up to 450 mm, display substrates, electronic devices, inert gas environment, HF/UHV vacuum systems, vacuum cluster systems, device test systems, transfer modules.

Adenso.Contact

+49 351 79 59 79 70

E-mail: info(at)adenso.de

Adenso Industrial Services GmbH
Adenso GmbH
Zur Wetterwarte 27
01109 Dresden
Germany

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