Together with the presentation of the new WHM300X wafer handling module and thus the extension of the production series specifically for 300 mm wafers in the vacuum environment, Adenso is presenting six further new products on this system, including three world premieres:

Three world firsts and three further fine modules:

1. STEALTH CARRIER for CRYOGENIC environments
   The special carriers have virtually no heat signature and are therefore particularly well suited for environments with liquid gas such as helium up to 4.2 K.
   For all kinds of substrates: 300/200/150/100/50 mm wafers, glass/ceramic/sapphire substrates, devices/chips, …
2. WHM330X4 handling robot with up to 4 end-effectors (so far, a maximum of 2 EE for handling robots were customary in the market)
   For greatest throughput and productivity and maximum flexibility, as different types of EE can be installed (wafers, carriers, cassettes, …)
3. FOUP300 VAC-LOAD-PORT
   for loading 300 mm wafers into cluster systems directly and without (!) the previously common atmospheric handling robot – saves an incredible amount of space and costs
4. LLM330 load lock module
   for 300 mm wafers/carriers/magazines
5. WAM300 wafer alignment module
   For automatic wafer alignment within the vacuum environment
6. MLL330 manual load lock
   for manually loading/unloading substrates that can be equipped with heating/cooling chucks for pre-/post-temperingBroschure download.pdf

Cleanrooms are valuable. You can find out exactly how valuable they are at the Adenso booth A4421 (shared booth of Silicon Saxony) at SEMICON.

In the field of wafer handling solutions, Adenso – which is part of Silicon Saxony – offers a range of products for substrate handling in vacuums and glove-box systems. Adenso robot solutions for high-vacuum environments possess a range of unique characteristics, which means that these solutions are used all over the world and are valued for their reliability, especially in semiconductor production.

The highly successful Adenso concept for VacBots offers customers a needs-based, tailored solution comprising existing or modified vacuum robotics modules.

The basic layout + wafer handling robot + wafer handling module + LoadLock module together create a turnkey product with defined interfaces.

But Adenso does more than just develop the technology for Industry 4.0 and the Internet of things, because it also deploys this technology in its own products. This means that the data from all Adenso robots is collected in a European Equipment.Cloud, meaning that customers benefit from precise and rapid data access to software updates, commissioning states, check lists, system parameters and documentation

“Thanks to its Equipment.Cloud, Adenso has transformed, in a simple and helpful way, the Internet of things into something that can be understood and experienced,” says W. Weinrich, project manager at Bühler AG.